Popcorn failure and unstable void growth in plastic electronic packages
Key Engineering Materials
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2014
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sg-nus-scholar.10635-737632015-03-13T21:16:06Z Popcorn failure and unstable void growth in plastic electronic packages Chong, C.W. Guo, T.F. Cheng, L. MECHANICAL ENGINEERING FEA IC packages Multiaxial straining Popcorn failure Unstable void growth Key Engineering Materials 227 61-66 KEMAE 2014-06-19T05:39:03Z 2014-06-19T05:39:03Z 2002 Conference Paper Chong, C.W.,Guo, T.F.,Cheng, L. (2002). Popcorn failure and unstable void growth in plastic electronic packages. Key Engineering Materials 227 : 61-66. ScholarBank@NUS Repository. 10139826 http://scholarbank.nus.edu.sg/handle/10635/73763 NOT_IN_WOS Scopus |
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National University of Singapore |
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Singapore |
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FEA IC packages Multiaxial straining Popcorn failure Unstable void growth |
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FEA IC packages Multiaxial straining Popcorn failure Unstable void growth Chong, C.W. Guo, T.F. Cheng, L. Popcorn failure and unstable void growth in plastic electronic packages |
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Key Engineering Materials |
author2 |
MECHANICAL ENGINEERING |
author_facet |
MECHANICAL ENGINEERING Chong, C.W. Guo, T.F. Cheng, L. |
format |
Conference or Workshop Item |
author |
Chong, C.W. Guo, T.F. Cheng, L. |
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Chong, C.W. |
title |
Popcorn failure and unstable void growth in plastic electronic packages |
title_short |
Popcorn failure and unstable void growth in plastic electronic packages |
title_full |
Popcorn failure and unstable void growth in plastic electronic packages |
title_fullStr |
Popcorn failure and unstable void growth in plastic electronic packages |
title_full_unstemmed |
Popcorn failure and unstable void growth in plastic electronic packages |
title_sort |
popcorn failure and unstable void growth in plastic electronic packages |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/73763 |
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1681087807044452352 |