APA Citation

Chong, C., Guo, T., Cheng, L., & ENGINEERING, M. (2014). Popcorn failure and unstable void growth in plastic electronic packages.

Chicago Style Citation

Chong, C.W., T.F Guo, L. Cheng, and MECHANICAL ENGINEERING. Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages. 2014.

MLA Citation

Chong, C.W., T.F Guo, L. Cheng, and MECHANICAL ENGINEERING. Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages. 2014.

Warning: These citations may not always be 100% accurate.