Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages

Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages

10.1109/TCAPT.2007.901721

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Bibliographic Details
Main Authors: Chew, H.B., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Fracture mechanisms
Plastic integrated circuit (IC) package
Porous material
Residual stress
Vapor pressure
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85994
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/85994

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