An effective method for calculation of corner stresses with applications to plastic IC packages

• Main Authors: Zhou, W., Lim, K.-M., Tay, A.A.O.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Finite element method (FEM); Integrated circuit (IC); Thin small outline package (TSOP)
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73156
• Institution: National University of Singapore

10.1109/TCAPT.2007.906736