An effective method for calculation of corner stresses with applications to plastic IC packages
10.1109/TCAPT.2007.906736
Saved in:
Main Authors: | Zhou, W., Lim, K.-M., Tay, A.A.O. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73156 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Moisture diffusion and heat transfer in plastic IC packages
by: Tay, A.A.O., et al.
Published: (2014) -
Reduction of IC package warpage through finite element analysis and direct optimization
by: Moran, Roberto Louis, et al.
Published: (2019) -
Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
by: Liu, P., et al.
Published: (2014) -
A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging
by: HU GUOJUN
Published: (2011) -
Numerical simulation of interface delamination - with application to IC packaging
by: CHEONG WEE GEE
Published: (2010)