Laser singulation of IC packages

Laser singulation of IC packages

10.1117/12.456850

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Bibliographic Details
Main Authors: An, C., Ye, K., Yuan, Y., Hong, M., Lu, Y.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
IC package
Laser machining
Multi-layer material cutting
Multi-scan
Singulation
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70767
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/70767

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