Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages

Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages

10.1109/TCAPT.2007.901721

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Bibliographic Details
Main Authors: Chew, H.B., Guo, T.F., Cheng, L.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Fracture mechanisms
Plastic integrated circuit (IC) package
Porous material
Residual stress
Vapor pressure
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85994
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Institution: National University of Singapore
id sg-nus-scholar.10635-85994
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spelling sg-nus-scholar.10635-859942024-11-11T04:52:10Z Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages Chew, H.B. Guo, T.F. Cheng, L. MECHANICAL ENGINEERING MATERIALS SCIENCE AND ENGINEERING Fracture mechanisms Plastic integrated circuit (IC) package Porous material Residual stress Vapor pressure 10.1109/TCAPT.2007.901721 IEEE Transactions on Components and Packaging Technologies 31 2 SPEC. ISS. 277-284 ITCPF 2014-10-07T09:14:38Z 2014-10-07T09:14:38Z 2008 Conference Paper Chew, H.B., Guo, T.F., Cheng, L. (2008). Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages. IEEE Transactions on Components and Packaging Technologies 31 (2 SPEC. ISS.) : 277-284. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2007.901721 15213331 http://scholarbank.nus.edu.sg/handle/10635/85994 000256584600006 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Fracture mechanisms
Plastic integrated circuit (IC) package
Porous material
Residual stress
Vapor pressure
spellingShingle Fracture mechanisms
Plastic integrated circuit (IC) package
Porous material
Residual stress
Vapor pressure
Chew, H.B.
Guo, T.F.
Cheng, L.
Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages
description 10.1109/TCAPT.2007.901721
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Chew, H.B.
Guo, T.F.
Cheng, L.
format Conference or Workshop Item
author Chew, H.B.
Guo, T.F.
Cheng, L.
author_sort Chew, H.B.
title Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages
title_short Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages
title_full Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages
title_fullStr Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages
title_full_unstemmed Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages
title_sort influence of nonuniform initial porosity distribution on adhesive failure in electronic packages
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/85994
_version_ 1821197837830979584

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