Advances in vapor pressure modeling for electronic packaging

Advances in vapor pressure modeling for electronic packaging

10.1109/TADVP.2006.879423

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Bibliographic Details
Main Authors: Wong, E.H., Koh, S.W., Lee, K.H., Lim, K.-M., Lim, T.B., Mai, Y.-W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Moisture
Popcorn
Reflow
Vapor pressure
Wetness
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59392
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Institution: National University of Singapore
id sg-nus-scholar.10635-59392
record_format dspace
spelling sg-nus-scholar.10635-593922023-10-25T21:35:16Z Advances in vapor pressure modeling for electronic packaging Wong, E.H. Koh, S.W. Lee, K.H. Lim, K.-M. Lim, T.B. Mai, Y.-W. MECHANICAL ENGINEERING Moisture Popcorn Reflow Vapor pressure Wetness 10.1109/TADVP.2006.879423 IEEE Transactions on Advanced Packaging 29 4 751-759 ITAPF 2014-06-17T06:10:56Z 2014-06-17T06:10:56Z 2006-11 Article Wong, E.H., Koh, S.W., Lee, K.H., Lim, K.-M., Lim, T.B., Mai, Y.-W. (2006-11). Advances in vapor pressure modeling for electronic packaging. IEEE Transactions on Advanced Packaging 29 (4) : 751-759. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2006.879423 15213323 http://scholarbank.nus.edu.sg/handle/10635/59392 000241965300012 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Moisture
Popcorn
Reflow
Vapor pressure
Wetness
spellingShingle Moisture
Popcorn
Reflow
Vapor pressure
Wetness
Wong, E.H.
Koh, S.W.
Lee, K.H.
Lim, K.-M.
Lim, T.B.
Mai, Y.-W.
Advances in vapor pressure modeling for electronic packaging
description 10.1109/TADVP.2006.879423
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Wong, E.H.
Koh, S.W.
Lee, K.H.
Lim, K.-M.
Lim, T.B.
Mai, Y.-W.
format Article
author Wong, E.H.
Koh, S.W.
Lee, K.H.
Lim, K.-M.
Lim, T.B.
Mai, Y.-W.
author_sort Wong, E.H.
title Advances in vapor pressure modeling for electronic packaging
title_short Advances in vapor pressure modeling for electronic packaging
title_full Advances in vapor pressure modeling for electronic packaging
title_fullStr Advances in vapor pressure modeling for electronic packaging
title_full_unstemmed Advances in vapor pressure modeling for electronic packaging
title_sort advances in vapor pressure modeling for electronic packaging
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/59392
_version_ 1781781619739197440

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