Investigating the cyclic bending of PCB subassembly during board level drop test
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
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| Main Authors: | , , , , |
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| 格式: | Conference or Workshop Item |
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2014
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| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/73553 |
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| 機構: | National University of Singapore |