Investigating the cyclic bending of PCB subassembly during board level drop test

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Pek, E., Lim, C.T., Tee, T.Y., Luan, J.-E., Tan, V.B.C.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73553
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Institution: National University of Singapore