Board level drop test and simulation of TFBGA packages for telecommunication applications

Board level drop test and simulation of TFBGA packages for telecommunication applications

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors: Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73232
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/73232

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