Board level drop test and simulation of TFBGA packages for telecommunication applications
Proceedings - Electronic Components and Technology Conference
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2014
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sg-nus-scholar.10635-732322015-03-07T06:55:44Z Board level drop test and simulation of TFBGA packages for telecommunication applications Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 121-129 PECCA 2014-06-19T05:32:41Z 2014-06-19T05:32:41Z 2003 Conference Paper Tee, T.Y.,Ng, H.S.,Lim, C.T.,Pek, E.,Zhong, Z. (2003). Board level drop test and simulation of TFBGA packages for telecommunication applications. Proceedings - Electronic Components and Technology Conference : 121-129. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73232 NOT_IN_WOS Scopus |
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Proceedings - Electronic Components and Technology Conference |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z. |
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Conference or Workshop Item |
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Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z. |
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Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z. Board level drop test and simulation of TFBGA packages for telecommunication applications |
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Tee, T.Y. |
title |
Board level drop test and simulation of TFBGA packages for telecommunication applications |
title_short |
Board level drop test and simulation of TFBGA packages for telecommunication applications |
title_full |
Board level drop test and simulation of TFBGA packages for telecommunication applications |
title_fullStr |
Board level drop test and simulation of TFBGA packages for telecommunication applications |
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Board level drop test and simulation of TFBGA packages for telecommunication applications |
title_sort |
board level drop test and simulation of tfbga packages for telecommunication applications |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73232 |
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1681087710542954496 |