Board level drop test and simulation of TFBGA packages for telecommunication applications

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors: Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73232
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-732322015-03-07T06:55:44Z Board level drop test and simulation of TFBGA packages for telecommunication applications Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 121-129 PECCA 2014-06-19T05:32:41Z 2014-06-19T05:32:41Z 2003 Conference Paper Tee, T.Y.,Ng, H.S.,Lim, C.T.,Pek, E.,Zhong, Z. (2003). Board level drop test and simulation of TFBGA packages for telecommunication applications. Proceedings - Electronic Components and Technology Conference : 121-129. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73232 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Tee, T.Y.
Ng, H.S.
Lim, C.T.
Pek, E.
Zhong, Z.
format Conference or Workshop Item
author Tee, T.Y.
Ng, H.S.
Lim, C.T.
Pek, E.
Zhong, Z.
spellingShingle Tee, T.Y.
Ng, H.S.
Lim, C.T.
Pek, E.
Zhong, Z.
Board level drop test and simulation of TFBGA packages for telecommunication applications
author_sort Tee, T.Y.
title Board level drop test and simulation of TFBGA packages for telecommunication applications
title_short Board level drop test and simulation of TFBGA packages for telecommunication applications
title_full Board level drop test and simulation of TFBGA packages for telecommunication applications
title_fullStr Board level drop test and simulation of TFBGA packages for telecommunication applications
title_full_unstemmed Board level drop test and simulation of TFBGA packages for telecommunication applications
title_sort board level drop test and simulation of tfbga packages for telecommunication applications
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73232
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