Board level drop test and simulation of TFBGA packages for telecommunication applications

by Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z.
Published 2014

Mental health professionals' perceived barriers and benefits, and personal concerns in relation to psychiatric research

by Pek, E., Subramaniam, M., Vaingankar, J., Yiong, H.C., Mahendran, R.
Published 2016

Impact life prediction modeling of TFBGA packages under board level drop test

by Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z.
Published 2014

Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

by Tee, T.Y., Luan, J.-E., Pek, E., Lim, C.T., Zhong, Z.
Published 2014

Novel numerical and experimental analysis of dynamic responses under board level drop test

by Tee, T.Y., Luan, J.-E., Pek, E., Lim, C.T., Zhong, Z.
Published 2014

Dynamic responses and solder joint reliability under board level drop test

by Luan, J.-e., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z.
Published 2014

Study of PCB strains and component position under board level drop test

by Ng, F.K., Lim, C.T., Pek, E., Luan, J.-E., Tee, T.Y.
Published 2014

Investigating the cyclic bending of PCB subassembly during board level drop test

by Pek, E., Lim, C.T., Tee, T.Y., Luan, J.-E., Tan, V.B.C.
Published 2014

Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact

by Luan, J.-E., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z., Zhou, J.
Published 2014