Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

by Tee, T.Y., Luan, J.-E., Pek, E., Lim, C.T., Zhong, Z.
Published 2014

Novel numerical and experimental analysis of dynamic responses under board level drop test

by Tee, T.Y., Luan, J.-E., Pek, E., Lim, C.T., Zhong, Z.
Published 2014

Dynamic responses and solder joint reliability under board level drop test

by Luan, J.-e., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z.
Published 2014

Study of PCB strains and component position under board level drop test

by Ng, F.K., Lim, C.T., Pek, E., Luan, J.-E., Tee, T.Y.
Published 2014

Investigating the cyclic bending of PCB subassembly during board level drop test

by Pek, E., Lim, C.T., Tee, T.Y., Luan, J.-E., Tan, V.B.C.
Published 2014

Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact

by Luan, J.-E., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z., Zhou, J.
Published 2014