Investigating the cyclic bending of PCB subassembly during board level drop test

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors:	Pek, E., Lim, C.T., Tee, T.Y., Luan, J.-E., Tan, V.B.C.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73553
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73553
record_format	dspace
spelling	sg-nus-scholar.10635-735532015-02-21T03:50:04Z Investigating the cyclic bending of PCB subassembly during board level drop test Pek, E. Lim, C.T. Tee, T.Y. Luan, J.-E. Tan, V.B.C. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 276-282 2014-06-19T05:36:30Z 2014-06-19T05:36:30Z 2005 Conference Paper Pek, E.,Lim, C.T.,Tee, T.Y.,Luan, J.-E.,Tan, V.B.C. (2005). Investigating the cyclic bending of PCB subassembly during board level drop test. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 : 276-282. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/73553 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Pek, E. Lim, C.T. Tee, T.Y. Luan, J.-E. Tan, V.B.C.
format	Conference or Workshop Item
author	Pek, E. Lim, C.T. Tee, T.Y. Luan, J.-E. Tan, V.B.C.
spellingShingle	Pek, E. Lim, C.T. Tee, T.Y. Luan, J.-E. Tan, V.B.C. Investigating the cyclic bending of PCB subassembly during board level drop test
author_sort	Pek, E.
title	Investigating the cyclic bending of PCB subassembly during board level drop test
title_short	Investigating the cyclic bending of PCB subassembly during board level drop test
title_full	Investigating the cyclic bending of PCB subassembly during board level drop test
title_fullStr	Investigating the cyclic bending of PCB subassembly during board level drop test
title_full_unstemmed	Investigating the cyclic bending of PCB subassembly during board level drop test
title_sort	investigating the cyclic bending of pcb subassembly during board level drop test
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73553
_version_	1681087769251676160

Investigating the cyclic bending of PCB subassembly during board level drop test

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