Investigating the cyclic bending of PCB subassembly during board level drop test

• Main Authors: Pek, E., Lim, C.T., Tee, T.Y., Luan, J.-E., Tan, V.B.C.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73553
• Institution: National University of Singapore

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005