Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate

Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate

US6540866

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Bibliographic Details
Main Authors: ZHANG, JUNFENG, CUI, CHENG QIANG, LIM, THIAM BENG, KANG, EN-TANG
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32635
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/32635

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