Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate

• Main Authors: ZHANG, JUNFENG, CUI, CHENG QIANG, LIM, THIAM BENG, KANG, EN-TANG
• Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
• Format: Patent
• Published: 2012
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/32635
• Institution: National University of Singapore

US6540866