IC packaging lead frame for reducing chip stress and deformation

by LIM, THIAM BENG, BHANDARKAR, SARVOTHAM M.
Published 2012

Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate

by ZHANG, JUNFENG, CUI, CHENG QIANG, LIM, THIAM BENG, KANG, EN-TANG
Published 2012

Method for low temperature lamination of metals to polyimides

by KANG, EN-TANG, ANG, ARTHUR KHOON SIAH, NEOH, KOON GEE, CUI, CHENG QIANG, LIM, THIAM BENG
Published 2012

Method for low temperature lamination of metals to fluoropolymers

by KANG, EN TANG, SHI, JIAN-LI, NEOH, KOON GEE, TAN, KUANG LEE, CUI, CHENG QIANG, LIM, THIAM BENG
Published 2012