Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate
US6540866
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2012
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/32635 |
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sg-nus-scholar.10635-326352015-07-29T07:03:47Z Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate ZHANG, JUNFENG CUI, CHENG QIANG LIM, THIAM BENG KANG, EN-TANG CHEMICAL & ENVIRONMENTAL ENGINEERING INSTITUTE OF MICROELECTRONICS INSTITUTE OF MICROELECTRONICS (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE US6540866 Granted Patent 2012-05-02T02:28:07Z 2012-05-02T02:28:07Z 2003-04-01 Patent ZHANG, JUNFENG,CUI, CHENG QIANG,LIM, THIAM BENG,KANG, EN-TANG (2003-04-01). Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32635 NOT_IN_WOS PatSnap |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
US6540866 |
| author2 |
CHEMICAL & ENVIRONMENTAL ENGINEERING |
| author_facet |
CHEMICAL & ENVIRONMENTAL ENGINEERING ZHANG, JUNFENG CUI, CHENG QIANG LIM, THIAM BENG KANG, EN-TANG |
| format |
Patent |
| author |
ZHANG, JUNFENG CUI, CHENG QIANG LIM, THIAM BENG KANG, EN-TANG |
| spellingShingle |
ZHANG, JUNFENG CUI, CHENG QIANG LIM, THIAM BENG KANG, EN-TANG Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| author_sort |
ZHANG, JUNFENG |
| title |
Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| title_short |
Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| title_full |
Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| title_fullStr |
Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| title_full_unstemmed |
Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| title_sort |
method for lamination of fluoropolymer to metal and printed circuit board (pcb) substrate |
| publishDate |
2012 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/32635 |
| _version_ |
1681081259301797888 |