Parametric studies and design of cushion packaging buffers for drop impact
In this project, a finite element modeling procedure for performing a virtual product-package drop test is successfully established. The drop test simulation using FEA is done using ANSYS/LS-DYNA. An improved cushion design procedure has been proposed.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5257 |
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| Institution: | Nanyang Technological University |