A review of board level solder joints for mobile applications
10.1016/j.microrel.2008.08.006
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Review |
| Published: |
2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/68091 |
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| Institution: | National University of Singapore |