A review of board level solder joints for mobile applications
10.1016/j.microrel.2008.08.006
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Main Authors: | Wong, E.H., Seah, S.K.W., Shim, V.P.W. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Review |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/68091 |
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Institution: | National University of Singapore |
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