A review of board level solder joints for mobile applications

10.1016/j.microrel.2008.08.006

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Bibliographic Details
Main Authors:	Wong, E.H., Seah, S.K.W., Shim, V.P.W.
Other Authors:	MECHANICAL ENGINEERING
Format:	Review
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/68091
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Institution:	National University of Singapore

Description
Summary:	10.1016/j.microrel.2008.08.006

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