A review of board level solder joints for mobile applications

10.1016/j.microrel.2008.08.006

Saved in:

Bibliographic Details
Main Authors:	Wong, E.H., Seah, S.K.W., Shim, V.P.W.
Other Authors:	MECHANICAL ENGINEERING
Format:	Review
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/68091
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-68091
record_format	dspace
spelling	sg-nus-scholar.10635-680912023-10-30T09:46:24Z A review of board level solder joints for mobile applications Wong, E.H. Seah, S.K.W. Shim, V.P.W. MECHANICAL ENGINEERING 10.1016/j.microrel.2008.08.006 Microelectronics Reliability 48 11-12 1747-1758 MCRLA 2014-06-18T06:09:39Z 2014-06-18T06:09:39Z 2008-11 Review Wong, E.H., Seah, S.K.W., Shim, V.P.W. (2008-11). A review of board level solder joints for mobile applications. Microelectronics Reliability 48 (11-12) : 1747-1758. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2008.08.006 00262714 http://scholarbank.nus.edu.sg/handle/10635/68091 000261626000001 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1016/j.microrel.2008.08.006
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Wong, E.H. Seah, S.K.W. Shim, V.P.W.
format	Review
author	Wong, E.H. Seah, S.K.W. Shim, V.P.W.
spellingShingle	Wong, E.H. Seah, S.K.W. Shim, V.P.W. A review of board level solder joints for mobile applications
author_sort	Wong, E.H.
title	A review of board level solder joints for mobile applications
title_short	A review of board level solder joints for mobile applications
title_full	A review of board level solder joints for mobile applications
title_fullStr	A review of board level solder joints for mobile applications
title_full_unstemmed	A review of board level solder joints for mobile applications
title_sort	review of board level solder joints for mobile applications
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/68091
_version_	1781782958889238528

A review of board level solder joints for mobile applications

Similar Items