Solder joint testing and failure analysis

• Main Author: Kang, Eng Tat.
• Other Authors: Pang Hock Lye, John
• Format: Final Year Project
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/50170
• Institution: Nanyang Technological University

Adhesively bonded joints within most electronic devices are constantly subjected to a complex combination of tensile-shear loading. These devices are also likely to undergo thermo-mechanical cycling during device processing and service and therefore, the joints are likely to have existing low-cycle...