Design-for-reliability methodology for lead-free solder joints

In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology...

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Bibliographic Details
Main Author: Low, Tse Hoong
Other Authors: Pang, John Hock Lye
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/6112
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Institution: Nanyang Technological University