Design-for-reliability methodology for lead-free solder joints
In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology...
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Main Author: | Low, Tse Hoong |
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Other Authors: | Pang, John Hock Lye |
Format: | Theses and Dissertations |
Published: |
2008
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/6112 |
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Institution: | Nanyang Technological University |
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