Design-for-reliability methodology for lead-free solder joints
In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/6112 |
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| Institution: | Nanyang Technological University |
| Summary: | In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology aims to reduce the time taken to understand and improve the reliability and performance of electronic assemblies with lead-free solder joints. |
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