Design-for-reliability methodology for lead-free solder joints

In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology...

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書目詳細資料
主要作者: Low, Tse Hoong
其他作者: Pang, John Hock Lye
格式: Theses and Dissertations
出版: 2008
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在線閱讀:https://hdl.handle.net/10356/6112
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機構: Nanyang Technological University
實物特徵
總結:In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology aims to reduce the time taken to understand and improve the reliability and performance of electronic assemblies with lead-free solder joints.