Design-for-reliability methodology for lead-free solder joints

Design-for-reliability methodology for lead-free solder joints

In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology...

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Main Author: Low, Tse Hoong
Other Authors: Pang, John Hock Lye
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
Online Access:https://hdl.handle.net/10356/6112
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-61122023-03-11T17:36:35Z Design-for-reliability methodology for lead-free solder joints Low, Tse Hoong Pang, John Hock Lye School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology aims to reduce the time taken to understand and improve the reliability and performance of electronic assemblies with lead-free solder joints. MASTER OF ENGINEERING (MPE) 2008-09-17T11:07:03Z 2008-09-17T11:07:03Z 2005 2005 Thesis Low, T. H. (2005). Design-for-reliability methodology for lead-free solder joints. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/6112 10.32657/10356/6112 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
spellingShingle DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
Low, Tse Hoong
Design-for-reliability methodology for lead-free solder joints
description In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology aims to reduce the time taken to understand and improve the reliability and performance of electronic assemblies with lead-free solder joints.
author2 Pang, John Hock Lye
author_facet Pang, John Hock Lye
Low, Tse Hoong
format Theses and Dissertations
author Low, Tse Hoong
author_sort Low, Tse Hoong
title Design-for-reliability methodology for lead-free solder joints
title_short Design-for-reliability methodology for lead-free solder joints
title_full Design-for-reliability methodology for lead-free solder joints
title_fullStr Design-for-reliability methodology for lead-free solder joints
title_full_unstemmed Design-for-reliability methodology for lead-free solder joints
title_sort design-for-reliability methodology for lead-free solder joints
publishDate 2008
url https://hdl.handle.net/10356/6112
_version_ 1761781462407839744

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