Design-for-reliability methodology for lead-free solder joints

• المؤلف الرئيسي: Low, Tse Hoong
• مؤلفون آخرون: Pang, John Hock Lye
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/6112
• المؤسسة: Nanyang Technological University

In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology...