Lead free solder materials study
The paper aims to examine the creep performance of lead-free solder, SAC387 (95.5Sn-3.8Ag-0.7Cu) at various stress and temperature conditions. Five sets of test results with various stress levels and temperature conditions: (5MPa, 100C), (10MPa, 25C), (10MPa, 75C), (10MPa, 100C) and (15MPa, 100C), w...
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| Format: | Final Year Project |
| Language: | English |
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Nanyang Technological University
2020
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| Online Access: | https://hdl.handle.net/10356/141802 |
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| Institution: | Nanyang Technological University |
| Language: | English |