Lead free solder materials study

• المؤلف الرئيسي: Nash Hairie Rosly
• مؤلفون آخرون: Pang Hock Lye, John
• التنسيق: Final Year Project
• اللغة: English
• منشور في: Nanyang Technological University 2020
• الموضوعات: Engineering::Mechanical engineering; Engineering::Materials::Mechanical strength of materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/141802
• المؤسسة: Nanyang Technological University

The paper aims to examine the creep performance of lead-free solder, SAC387 (95.5Sn-3.8Ag-0.7Cu) at various stress and temperature conditions. Five sets of test results with various stress levels and temperature conditions: (5MPa, 100C), (10MPa, 25C), (10MPa, 75C), (10MPa, 100C) and (15MPa, 100C), w...