Industrial attachment report on quality and reliability of Pb-free solder joint

This report presented four sub-projects done for the respective QRA aspects for Pb-free solder joint. They are comparison of the common Sn/Pb and Pb-free solder paste; inter-metallic study of common Sn/Pb and Pb-free Solder Paste' Pb-free Module Relia

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Bibliographic Details
Main Author: Marsellus Yohz Hendryanto
Other Authors: Miao, Jianmin
Format: Industrial Attachment (IA)
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/8035
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Institution: Nanyang Technological University