Industrial attachment report on quality and reliability of Pb-free solder joint

• Main Author: Marsellus Yohz Hendryanto
• Other Authors: Miao, Jianmin
• Format: Industrial Attachment (IA)
• Published: 2008
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/8035
• Institution: Nanyang Technological University

This report presented four sub-projects done for the respective QRA aspects for Pb-free solder joint. They are comparison of the common Sn/Pb and Pb-free solder paste; inter-metallic study of common Sn/Pb and Pb-free Solder Paste' Pb-free Module Relia