Report on industrial attachment with Cookson Semiconductor Packaging Materials

Report on industrial attachment with Cookson Semiconductor Packaging Materials

The emphasis of this report is on the projects undertaken and the knowledge gained during the 24 weeks of Industrial Attachment at Cookson Semiconductor Packaging Materials (CSPM) under the Electronic Polymers Department (EP).

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Bibliographic Details
Main Author: Koo, Yeng Ping.
Other Authors: School of Mechanical and Production Engineering
Format: Industrial Attachment (IA)
Published: 2008
Subjects:
DRNTU::Engineering::Materials
Online Access:http://hdl.handle.net/10356/8048
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Institution: Nanyang Technological University

Internet

http://hdl.handle.net/10356/8048

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