Report on industrial attachment with Cookson Semiconductor Packaging Materials

The emphasis of this report is on the projects undertaken and the knowledge gained during the 24 weeks of Industrial Attachment at Cookson Semiconductor Packaging Materials (CSPM) under the Electronic Polymers Department (EP).

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Bibliographic Details
Main Author:	Koo, Yeng Ping.
Other Authors:	School of Mechanical and Production Engineering
Format:	Industrial Attachment (IA)
Published:	2008
Subjects:	DRNTU::Engineering::Materials
Online Access:	http://hdl.handle.net/10356/8048
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Institution:	Nanyang Technological University

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spelling	sg-ntu-dr.10356-80482023-03-04T15:32:19Z Report on industrial attachment with Cookson Semiconductor Packaging Materials Koo, Yeng Ping. School of Mechanical and Production Engineering DRNTU::Engineering::Materials The emphasis of this report is on the projects undertaken and the knowledge gained during the 24 weeks of Industrial Attachment at Cookson Semiconductor Packaging Materials (CSPM) under the Electronic Polymers Department (EP). 2008-09-19T01:55:36Z 2008-09-19T01:55:36Z 2004 2004 Industrial Attachment (IA) http://hdl.handle.net/10356/8048 Nanyang Technological University 53 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials
spellingShingle	DRNTU::Engineering::Materials Koo, Yeng Ping. Report on industrial attachment with Cookson Semiconductor Packaging Materials
description	The emphasis of this report is on the projects undertaken and the knowledge gained during the 24 weeks of Industrial Attachment at Cookson Semiconductor Packaging Materials (CSPM) under the Electronic Polymers Department (EP).
author2	School of Mechanical and Production Engineering
author_facet	School of Mechanical and Production Engineering Koo, Yeng Ping.
format	Industrial Attachment (IA)
author	Koo, Yeng Ping.
author_sort	Koo, Yeng Ping.
title	Report on industrial attachment with Cookson Semiconductor Packaging Materials
title_short	Report on industrial attachment with Cookson Semiconductor Packaging Materials
title_full	Report on industrial attachment with Cookson Semiconductor Packaging Materials
title_fullStr	Report on industrial attachment with Cookson Semiconductor Packaging Materials
title_full_unstemmed	Report on industrial attachment with Cookson Semiconductor Packaging Materials
title_sort	report on industrial attachment with cookson semiconductor packaging materials
publishDate	2008
url	http://hdl.handle.net/10356/8048
_version_	1759854861988397056

Report on industrial attachment with Cookson Semiconductor Packaging Materials

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