Report on industrial attachment with Cookson Semiconductor Packaging Materials

• Main Author: Koo, Yeng Ping.
• Other Authors: School of Mechanical and Production Engineering
• Format: Industrial Attachment (IA)
• Published: 2008
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/8048
• Institution: Nanyang Technological University

The emphasis of this report is on the projects undertaken and the knowledge gained during the 24 weeks of Industrial Attachment at Cookson Semiconductor Packaging Materials (CSPM) under the Electronic Polymers Department (EP).