Solder joints morphology study on stacked die

• المؤلف الرئيسي: Lee, Yi Xuan.
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/44253
• المؤسسة: Nanyang Technological University

The shift from two dimensional (2D) technology to 3D packaging technology is seen as the only way to incorporate high performance into device miniaturization. Solder joint morphology has become the main reliability concern in the 3D interconnect system which is complicated by the implementation of 3...