Vibration and thermal cycling effects on solder joint reliability

• المؤلف الرئيسي: Selvanathen, Daryl
• مؤلفون آخرون: Pang Hock Lye, John
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering::Mechanical engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/60912

This report describes vibration and thermal cycling effects on solder joint reliability, especially its relationship concerning the life prediction of solder joints. It highlights critical parameters needed to support a better understanding of solder joint reliability arising from failure mechanisms...