Vibration and thermal cycling effects on solder joint reliability
This report describes vibration and thermal cycling effects on solder joint reliability, especially its relationship concerning the life prediction of solder joints. It highlights critical parameters needed to support a better understanding of solder joint reliability arising from failure mechanisms...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/60912 |
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| Institution: | Nanyang Technological University |
| Language: | English |