Vibration and thermal cycling effects on solder joint reliability

• Main Author: Selvanathen, Daryl
• Other Authors: Pang Hock Lye, John
• Format: Final Year Project
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/60912
• Institution: Nanyang Technological University

This report describes vibration and thermal cycling effects on solder joint reliability, especially its relationship concerning the life prediction of solder joints. It highlights critical parameters needed to support a better understanding of solder joint reliability arising from failure mechanisms...