Vibration and thermal cycling effects on solder joint reliability

• 主要作者: Selvanathen, Daryl
• 其他作者: Pang Hock Lye, John
• 格式: Final Year Project
• 語言: English
• 出版: 2014
• 主題: DRNTU::Engineering::Mechanical engineering
• 在線閱讀: http://hdl.handle.net/10356/60912

This report describes vibration and thermal cycling effects on solder joint reliability, especially its relationship concerning the life prediction of solder joints. It highlights critical parameters needed to support a better understanding of solder joint reliability arising from failure mechanisms...