Vibration and thermal cycling effects on solder joint reliability

• Main Author: Selvanathen, Daryl
• Other Authors: Pang Hock Lye, John
• Format: Final Year Project
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/60912
• Institution: Nanyang Technological University

This report describes vibration and thermal cycling effects on solder joint reliability, especially its relationship concerning the life prediction of solder joints. It highlights critical parameters needed to support a better understanding of solder joint reliability arising from failure mechanisms due to high temperatures, vibration, shock, thermal cycling or a combined variety of them. The literature review includes the necessary foundational knowledge in this subject matter where the estimation of fatigue life, evaluation of random vibration and thermal cycling failures are reviewed. Furthermore, several sample problems were included to aid in understanding. Fatigue life prediction methods such as Linear Damage Superposition Approach (LDSA), Incremental Damage Superposition Approach (IDSA) and Rapid Life Prediction Approach (RLPA) were reviewed and their outcomes discussed. Non-linear cumulative damage summation was also explored. Lastly, a conclusion was drawn when the above-mentioned lifetime models were pitted against one another. Their results were compared and scrutinised. It highlighted the proclivity of LDSA to overestimate fatigue life while IDSA had the best life prediction amongst the models. However, parameters like interaction factors, coefficients and exponents can affect precise life predictions if relationships between them with materials, vibration and temperature are not thoroughly understood.