Deep learning based solder joint defect detection on industrial printed circuit board X-ray images

• المؤلفون الرئيسيون: Zhang, Qianru, Zhang, Meng, Gamanayake, Chinthaka, Yuen, Chau, Geng, Zehao, Jayasekara, Hirunima, Woo, Chia-wei, Low, Jenny, Liu, Xiang, Guan, Yong Liang
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2023
• الموضوعات: Engineering::Electrical and electronic engineering; Joint Defect Detection; Deep Learning
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/164916
• المؤسسة: Nanyang Technological University

With the improvement of electronic circuit production methods, such as reduction of component size and the increase of component density, the risk of defects is increasing in the production line. Many techniques have been incorporated to check for failed solder joints, such as X-ray imaging, optical...