Deep learning based solder joint defect detection on industrial printed circuit board X-ray images

• Main Authors: Zhang, Qianru, Zhang, Meng, Gamanayake, Chinthaka, Yuen, Chau, Geng, Zehao, Jayasekara, Hirunima, Woo, Chia-wei, Low, Jenny, Liu, Xiang, Guan, Yong Liang
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2023
• Subjects: Engineering::Electrical and electronic engineering; Joint Defect Detection; Deep Learning
• Online Access: https://hdl.handle.net/10356/164916
• Institution: Nanyang Technological University

With the improvement of electronic circuit production methods, such as reduction of component size and the increase of component density, the risk of defects is increasing in the production line. Many techniques have been incorporated to check for failed solder joints, such as X-ray imaging, optical...