Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints

Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints

10.1109/EPTC.2010.5702676

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Bibliographic Details
Main Authors: Chandra Rao, B.S.S., Fernandez, D.M., Kripesh, V., Zeng, K.Y.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85942
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/85942

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