Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints
10.1109/EPTC.2010.5702676
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2014
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sg-nus-scholar.10635-859422015-02-02T22:07:40Z Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints Chandra Rao, B.S.S. Fernandez, D.M. Kripesh, V. Zeng, K.Y. MECHANICAL ENGINEERING 10.1109/EPTC.2010.5702676 2010 12th Electronics Packaging Technology Conference, EPTC 2010 423-428 2014-10-07T09:14:00Z 2014-10-07T09:14:00Z 2010 Conference Paper Chandra Rao, B.S.S.,Fernandez, D.M.,Kripesh, V.,Zeng, K.Y. (2010). Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints. 2010 12th Electronics Packaging Technology Conference, EPTC 2010 : 423-428. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2010.5702676" target="_blank">https://doi.org/10.1109/EPTC.2010.5702676</a> 9781424485604 http://scholarbank.nus.edu.sg/handle/10635/85942 NOT_IN_WOS Scopus |
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National University of Singapore |
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Singapore |
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ScholarBank@NUS |
| description |
10.1109/EPTC.2010.5702676 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Chandra Rao, B.S.S. Fernandez, D.M. Kripesh, V. Zeng, K.Y. |
| format |
Conference or Workshop Item |
| author |
Chandra Rao, B.S.S. Fernandez, D.M. Kripesh, V. Zeng, K.Y. |
| spellingShingle |
Chandra Rao, B.S.S. Fernandez, D.M. Kripesh, V. Zeng, K.Y. Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints |
| author_sort |
Chandra Rao, B.S.S. |
| title |
Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints |
| title_short |
Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints |
| title_full |
Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints |
| title_fullStr |
Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints |
| title_full_unstemmed |
Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints |
| title_sort |
effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85942 |
| _version_ |
1681089892945231872 |