Drop impact: Fundamentals & impact characterisation of solder joints

• Main Authors: Wong, E.H., Rajoo, R., Mai, Y.W., Seah, S.K.W., Tsai, K.T., Yap, L.M.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73375
• Institution: National University of Singapore

Proceedings - Electronic Components and Technology Conference