Package reliability modeling and design analysis of bio-sensors

Thirteen design variations will be analysed for the solder joint reliability. The Strain Energy Density will be obtained from the studies and the solder joint fatigue life predicted. The effects of the thickness and polyimide coating layer that protects the exposed die, will also be examined for pac...

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Bibliographic Details
Main Author: Lim, Bee Huan.
Other Authors: Zhong, Zhaowei
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5993
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Institution: Nanyang Technological University