Package reliability modeling and design analysis of bio-sensors
Thirteen design variations will be analysed for the solder joint reliability. The Strain Energy Density will be obtained from the studies and the solder joint fatigue life predicted. The effects of the thickness and polyimide coating layer that protects the exposed die, will also be examined for pac...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5993 |
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| Institution: | Nanyang Technological University |
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