Package reliability modeling and design analysis of bio-sensors
Thirteen design variations will be analysed for the solder joint reliability. The Strain Energy Density will be obtained from the studies and the solder joint fatigue life predicted. The effects of the thickness and polyimide coating layer that protects the exposed die, will also be examined for pac...
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2008
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sg-ntu-dr.10356-59932023-03-11T17:08:58Z Package reliability modeling and design analysis of bio-sensors Lim, Bee Huan. Zhong, Zhaowei School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing::Product engineering Thirteen design variations will be analysed for the solder joint reliability. The Strain Energy Density will be obtained from the studies and the solder joint fatigue life predicted. The effects of the thickness and polyimide coating layer that protects the exposed die, will also be examined for package stress level. Master of Science (Biomedical Engineering) 2008-09-17T11:04:23Z 2008-09-17T11:04:23Z 2004 2004 Thesis http://hdl.handle.net/10356/5993 Nanyang Technological University application/pdf |
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Nanyang Technological University |
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NTU Library |
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Asia |
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Singapore Singapore |
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DRNTU::Engineering::Manufacturing::Product engineering |
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DRNTU::Engineering::Manufacturing::Product engineering Lim, Bee Huan. Package reliability modeling and design analysis of bio-sensors |
| description |
Thirteen design variations will be analysed for the solder joint reliability. The Strain Energy Density will be obtained from the studies and the solder joint fatigue life predicted. The effects of the thickness and polyimide coating layer that protects the exposed die, will also be examined for package stress level. |
| author2 |
Zhong, Zhaowei |
| author_facet |
Zhong, Zhaowei Lim, Bee Huan. |
| format |
Theses and Dissertations |
| author |
Lim, Bee Huan. |
| author_sort |
Lim, Bee Huan. |
| title |
Package reliability modeling and design analysis of bio-sensors |
| title_short |
Package reliability modeling and design analysis of bio-sensors |
| title_full |
Package reliability modeling and design analysis of bio-sensors |
| title_fullStr |
Package reliability modeling and design analysis of bio-sensors |
| title_full_unstemmed |
Package reliability modeling and design analysis of bio-sensors |
| title_sort |
package reliability modeling and design analysis of bio-sensors |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/5993 |
| _version_ |
1761781744815570944 |